Vapor phase reflow oven.
Vapor phase oven.
Vapour phase oven the heating of the pcbs is sourced by thermal energy emitted by the phase transition of a heat transfer liquid e.
However for greater process accuracy higher quality solder joints consistently repeatable heating and lower reflow costs vapor phase soldering also known as condensation soldering or vapor phase reflow is the most flexible simplest and most reliable reflow soldering method.
The two methods only differ in the heating up phase hot air and vapor phase.
Vapor phase soldering also well known as condensation soldering uses for the heating up process of the assemblies the thermal energy which is emitted by phase change of the heat transfer medium from gas like to liquid state.
Unlike ir or convection batch type ovens with varying temperature control concerns our vapor phase ovens provide you with evenly distributed temperature throughout the production cycle completely under your control.
Smt reflow soldering ovens and vapor phase soldering systems solder reflow ovens and vapor phase reflow soldering systems for all levels of smt pcb assembly from prototyping to full production.
Some advantages of vapour phase soldering are.
Due to different magnitudes of heat transfer the vapor phase drying process allows for faster drying whereas the hot air process is easier to implement.
The vapor phase process is the ideal solution to reflow temperature control issues in small batch production runs.
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The liquid used is chosen with a desired boiling point in mind to suit the solder alloy to be reflowed.
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Pfpe condensing on the pcbs.
A 230 c boiling fluid g.
Simple made home made vapor phase oven.
Some facts about us 1.
The other boards are reflowed in a vapor phase oven using a fluid with a 240 c boiling point.
3l becher pyrex heater cheap chinese like and an optional thermocouple reader.
All users can use.
It is ideally suited for all types of smt components and base materials.
Unlike convection this type of ovens uses condensation or vapor phase for soldering.
Generally there are three steps to the process.
This oven is able to produce the profile in figure 3 especially the ramp rate through the liquidus range.
In contrast with the convection reflow oven the vapor phase reflow oven has a much smaller footprint and the pcb assembly moves vertically up and down instead of sideways.